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Wafer Probing
Package Testing
Customized Test Solution
Package Testing
Giga Solution offers completed RF test services ranging from test program development and test structure design to prototype characterization and production tests. With experienced test
engineers and state-of-the-art technology, GS is positioned and focused on RF test technologies to help customers reduce product development time and cost. GS' testing service can provide the following services with maximum engineering capabilities.
 

Package Test Service :
‧Prototype Characterization
‧Functional Test & Bench
‧Test Program Development and Conversion
‧DUT Board Design and Correlation
‧Fixture Design and Correlation
‧Lead Scanning & Rework
‧Reflow Process
‧Baking
‧Drop Shipment

Customer Service :
‧WIP Report
‧Yield Analysis
‧Cycle Time Report
‧Periodically Test data Transfer
‧Test Time Optimization