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Package Testing |
Giga Solution offers completed RF test services ranging from test program development and test structure design to prototype characterization and production tests. With experienced test engineers and state-of-the-art technology, GS is positioned and focused on RF test technologies to help customers reduce product development time and cost. GS' testing service can provide the following services with maximum engineering capabilities. |
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Package Test Service : ‧Prototype Characterization ‧Functional Test & Bench ‧Test Program Development and Conversion ‧DUT Board Design and Correlation ‧Fixture Design and Correlation ‧Lead Scanning & Rework ‧Reflow Process ‧Baking ‧Drop Shipment |
Customer Service : ‧WIP Report ‧Yield Analysis ‧Cycle Time Report ‧Periodically Test data Transfer ‧Test Time Optimization | | |
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Wafer Probing
An increase in the IC with higher complexity and speed, particularly in wireless, makes the lower yields and the higher package costs...
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Package Testing
Giga Solution offers completed RF test services ranging from test program development and test structure...
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Customized Test Solution
The rapid development in wireless communication chip design has extended the challenges...
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