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| Wafer Probing |
| Know good die (KGD) is more and more important because of the trend of SiP and IC also becomes more complexity. Our on-wafer test solution provides one-stop service to meet customers' different requirements. |
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Wafer Test Service :
‧6", 8", 12" wafer probing
‧Tri-temp wafer probing
‧Bumped wafer probing
‧Singulated wafer probing
‧Thin wafer probing
‧Wafer level SLT
‧Wafer AOI
‧Test program development
‧Probe card design and manufacture
‧ISS calibration
‧Drop shipment
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Customer Service :
‧WIP Report
‧Yield Analysis
‧Cycle Time Report
‧Periodically Test data Transfer
‧Test Time Optimization | | |
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Wafer Probing
An increase in the IC with higher complexity and speed, particularly in wireless, makes the lower yields and the higher package costs...
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Package Testing
Giga Solution offers completed RF test services ranging from test program development and test structure...
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Customized Test Solution
The rapid development in wireless communication chip design has extended the challenges...
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