WLCSP Turn Key Service
Partnership with Ardentec and Raytek for WLCSP RDL/Bumping/ Die Process Service
GS provide Frame Probing(FP3000) and Die Sorting(RT/RS20, Mi40) Service
High volume production capability
- Frame prober minimum die size: 0.2x0.2mm
- Die sorter minimum die size: 0.6x0.3mm