EMI Shielding Package Test Solution
- Handler Type: SRM HW32
- Package Type: EMI-Shielding package, DSMBGA, mini-BGA
- Input Format: T&R, Waffle tray and Jedec Tray
- Key Features
High volume production capability
Minimum Package Size Handling Capability: 0.8x0.8mm
Minimum Package 6S Defect Detectable size: 60x60um
Scratches, Contamination, Chipped Off, Incomplete Mold, Void, Mold Flashes, Crack, Empty unit
- 3D BGA Balls inspection
- BSIR inspection
- Scan Package 2D ID code(or OCR) to Test Datalog/Reel Report