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| Wafer Test |
| An increase in the IC with higher complexity and speed, particularly in wireless, makes the lower yields and the higher package costs, creating a need for RF sorting before packaging to save package scrap. Rising integration level and package inductance requirements will imply chip-scale packages (CSPs), flip-chip assembly with known-good die (KGD) and/or expensive multi-chip modules(MCM's) for high-value chips. As a result, the requirement for wafer sorting in production is the market demand. |
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Wafer Test Service :
‧Prototype characterization
‧DC/RF Functional test
‧Test program development and conversion
‧Membrane probe card design and correlation
‧Inking/inkless file
‧Baking
‧Packing
‧Drop shipment |
Customer Service :
‧WIP Report
‧Yield Analysis
‧Cycle Time Report
‧Periodically Test data Transfer
‧Test Time Optimization | | |
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Wafer Test
An increase in the IC with higher complexity and speed, particularly in wireless, makes the lower yields and the higher package costs...
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Package Test
Giga Solution offers completed RF test services ranging from test program development and test structure...
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Custom Test Solution
The rapid development in wireless communication chip design has extended the challenges...
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